Is your electronic cooling system ‘blowing off steam’ the right way?

Key Points from the webinar:

• Why Thermal & Shock Analysis Matters 
• Miniaturization and rising power densities demand robust heat management. 
• Mechanical stress during drops or transit causes hidden failures in PCBs. 
• Thermal Environment of PCBs 
• Heat sources: processors, regulators, power ICs. 
• Role of layout, airflow, and materials like thermal vias and TIMs. 
• Shock Analysis & Physical Durability 
• Drop simulation methods, common failure modes, and mitigation strategies. 
• Mounting techniques and design-for-shock considerations. 
• Hand Calculations - Case Study Highlight 
• Hand Calculation methods to calculate maximum temperature of a PCB. 
• Simulation tools process overview. 
• Standards & Compliance 
• Key standards: IEC 60068, IEC 61000-4, ISO 9001. 
• Testing for temperature, shock, and mechanical stress as part of product validation. 
• Our Capabilities 
• Simulation services, compliance consulting, root cause analysis, custom reporting. 

Key Takeaways 

• Early-stage simulation saves time, cost, and reputational damage. 
• Integrated thermal + shock analysis is essential for real-world reliability. 
• Global standards guide safe, durable product development. 
• Decos supports complete electronic reliability workflows—from design to validation.